Manager - HR at Den Networks Ltd
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Den Networks - Senior Manager - STB Life Cycle Management (8-10 yrs)
Job Purpose : Product planning, evaluation, development, overall project Management and Quality control of New and existing models of Set Top Boxes and features.
Competencies, Knowledge and Experience :
Education Qualification :
- M.B.A (operations & Marketing)
- B.Tech (Electronics & Communication)
Relevant Experience : 8-10 Years
Competencies (Primary and Secondary) :
1. CPE Product planning, Development, testing and life cycle management of new & legacy STBs.
2. Ability to lead a team and good communication and inter personnel skills.
Principal Accountabilities and Key Deliverables :
S/N Expected End Result :
1) Operations :
- Technical support and management of more than 8 million STBs with 11 models already deployed in the field.
- Support to field staff on escalated STB issues.
- Weekly calls and day to day interaction with all India Operations & Logistics team to improve the overall repair process.
- Periodic repair MIS generation for top management and Regional Ops team.
2) Quality :
1. SW bug management with NDS, Cisco & field
2. Software and hardware testing for new and legacy STBs.
3. Technical support to repair centres & QC of repair processes.
4. Periodic inspection / audit of repair vendor sites.
5. Interaction with STB vendors for corrective HW changes to reduce failure rate.
3) CSAT (Customer Satisfaction) :
- Periodic training to Customer care agents / RCSEs / field engineers.
- Periodic Interaction with DEN Customer service team for new updates and features w.r.t STBs.
4) Complaint Management : Attending to escalated issues from the field.
5) Project Management :
1.Gathering requirements from Business development or management for new STBs, features and applications.
2.Releasing and evaluation of RFP for new STBs.
3. End to end project management from Kick-off to field trial and mass production.
4.Continuous interaction with OEMs, silicon and other vendors for new developments and updates.
5.Tracking of Silicon chip set roadmap for different vendors.
Dimensions :
1) Timely delivery of new projects
2) Pre-emptive finding of new bugs and issues in testlab.
3) Proper resolution of field issues.
Challenges :
1.Going in for new features in term of hardware and software while keeping Cost benefit analysis in mind.
2.Maintaining a balance between internal stakeholders (Management and business operations) and external stakeholders (OEMs, chip vendors and repair partners).
3. Team motivation at all times.
Budget : Up to 13 lpa
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