Delivery Lead at Peopleplus
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Senior/Staff IC Package Engineer (3-10 yrs)
Job Description (IC Package Engineer)
- Design Package layouts for multiple applications.
- Able to handle constraints-driven IC Package layout methodology.
- Having basic understanding on Signal integrity and power integrity concepts.
- Conduct layout reviews with internal layout and design teams.
- Release IC Package layout drawings to the various design teams and coordinates their layout activities by ensuring compliance with the Design rules.
- Design Rules Check (DRC): Perform design rule checks to ensure that the layout meets the specific manufacturing and design guidelines.
- Perform quality assurance by using CAM350 Gerber validation tools
- Deliver Accurate layout designs by having basic Knowledge on Design for Manufacturing (DFM): Consider manufacturability and DFA : Craft for Assembly and DFT: Design for Testing.
- Proven oral and written communication skills to connect with Customers and Multi-functional teams.
EDUCATION, EXPERIENCE & QUALIFICATION REQUIRED
- Proven ability in IC Package Layout Design.
- Electronics fundamentals, Hands On experience on layout tools like Cadence APD 17.4, latest versions. Design guidelines, Constraint's handling, Gerber generation and CAM 350, CAM validation.
- Experience in routing high speed interfaces like PCIe, DDR memory interface, UFS, GPIO etc.
- Must have shown understanding in SI (Signal Integrity) Routing guidelines.
- Must have proven understanding in PI (Power Integrity) Routing guidelines.
- Must have worked on Flip chip & Wirebond BGA's.
- Solid understanding on Highspeed Routing Guidelines.
- Experienced in Mentor Hyper lynx DRC rules for Signal Integrity, Power Integrity tools, or similar is a plus. - Good Communication Social Skills, Excellent learning Problem solving ability.
- Capable of working independently and as a team member, good attention to detail.
- Excellent analytical skills and interpersonal proficiency.
