Job Description (IC Package Engineer)

- Design Package layouts for multiple applications.

- Able to handle constraints-driven IC Package layout methodology.

- Having basic understanding on Signal integrity and power integrity concepts.

- Conduct layout reviews with internal layout and design teams.

- Release IC Package layout drawings to the various design teams and coordinates their layout activities by ensuring compliance with the Design rules.

- Design Rules Check (DRC): Perform design rule checks to ensure that the layout meets the specific manufacturing and design guidelines.

- Perform quality assurance by using CAM350 Gerber validation tools

- Deliver Accurate layout designs by having basic Knowledge on Design for Manufacturing (DFM): Consider manufacturability and DFA : Craft for Assembly and DFT: Design for Testing.

- Proven oral and written communication skills to connect with Customers and Multi-functional teams. 

EDUCATION, EXPERIENCE & QUALIFICATION REQUIRED

- Proven ability in IC Package Layout Design.

- Electronics fundamentals, Hands On experience on layout tools like Cadence APD 17.4, latest versions. Design guidelines, Constraint's handling, Gerber generation and CAM 350, CAM validation.

- Experience in routing high speed interfaces like PCIe, DDR memory interface, UFS, GPIO etc.

- Must have shown understanding in SI (Signal Integrity) Routing guidelines.

- Must have proven understanding in PI (Power Integrity) Routing guidelines.

- Must have worked on Flip chip & Wirebond BGA's.

- Solid understanding on Highspeed Routing Guidelines.

- Experienced in Mentor Hyper lynx DRC rules for Signal Integrity, Power Integrity tools, or similar is a plus. - Good Communication Social Skills, Excellent learning Problem solving ability.

- Capable of working independently and as a team member, good attention to detail.

- Excellent analytical skills and interpersonal proficiency.

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